Assembler

Are you an Assembler looking to join one of the top companies in the Aerospace and Defense industry?

Are you looking to further your career and grow?

Do you have experience in wire-bonding and ribbon bonding (0.001" and 0.0007" wire and various ribbon sizes)?

If you answered yes to those three questions, then apply today!

Acara Solutions seeks highly qualified candidates to work on-site with our client in Chelmsford, MA. Interested?

Here's what you'd do:

• Performs fabrication or modification tasks on RF Microwave hybrid microcircuits and sub-assemblies.
• Duties include performing gold wire bonding using manual and automated 0.001" and 0.0007" machines and ribbon bonding to duroid and ceramic substrates, capacitors, resistors, diodes, spirals, and other microelectronic components.
• This position needs wire-bonding onto small pad sizes down to 0.001" in assemblies with very high semiconductor chip density and unusual substrate configurations, which need unique setup and bonding techniques.
• Duties will also include installation of substrates and components in highly complex microwave assemblies using paste and sheet epoxies.
• Measurement equipment (reticle, drop indicator, bond puller) is also needed to check parameters during and after work completion to ensure the unit conforms to specifications.
• Plans work sequence by assessing work in progress to schedule requirements.
• The position will also need collaboration with Manufacturing and Quality Engineering on procedures and troubleshooting methodologies.

Here's what you'll get:

Pay: $37.31 /hr.

Hours: 4/10A-2^nd Shift.

Length: Temp (12 Months).

Sounds like a good fit?

APPLY TODAY

About Acara Solutions

Acara is a premier recruiting and workforce solutions provider-we help companies compete for talent. With a legacy of experience in various industries worldwide, we partner with clients, listen to their needs, and customize visionary talent solutions that drive desired business outcomes. We leverage decades of experience to deliver contingent staffing, direct placement, executive search, and workforce services worldwide.

• High School Diploma or GED.
• Minimum of 2 years experience in wire-bonding and ribbon bonding (0.001' and 0.0007' wire and various ribbon sizes).
• Minimum of 2 years experience in microelectronics assembly (chip and wire assembly).

• Experience in the hybrid assembly by Mil-STD 883.
• Experience wire-bonding or ribbon bonding to ceramic or duroid substrates.
• Experience using Westbond and Metcal bonding machines and Unitech welders.
• Experience in substrate and component attach, auto pick-and-place.
• Experience operating auto or manual bonding equipment.
• Familiarity working in an ESD and FOD-controlled environment.
• Experience in mechanical assembly processes of small electronic devices.
• Experience working on military products in ISO 9001 / AS9100 controlled environments.
• Good dexterity and eye/hand coordination.
• Ability to read and work from detailed work instructions and drawings; computer skills are necessary to support retrieval of drawings, work instructions, and other job activities.
• Ability to work in a diverse team environment; Good interpersonal, teaming, and communication skills.
• This position will need the capability to troubleshoot defective hybrid circuit card assemblies by visually screening wire bonds or chip placement.

Additional Information:

• Upon offer of employment, the individual will be subject to a background check and a drug screen.
• Active Secret DoD Clearance.
• In compliance with federal law, all persons hired will be needed to verify identity and eligibility to work in the United States and to complete the necessary employment eligibility verification form upon hire.
• Ability to work 10 hours under a microscope and utilize hand tools such as torque drivers and tweezers.