RF SiP Design Leader - Director, Engineering

Skyworks Solutions, Inc
parental leave, paid time off, 401(k)
United States, California, San Jose
2740 Zanker Road (Show on map)
Nov 13, 2024
If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks is an innovator of high-performance analog semiconductors whose solutions are powering the wireless networking revolution.Through our broad technology expertise and one of the most extensive product portfolios in the industry, we are Connecting Everyone and Everything, All the Time. At Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management, and the freedom to make meaningful contributions in a setting that encourages creative thinking. We value open communication, mutual trust, and respect. We are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together are changing the way the world communicates. Requisition ID:73351 Overview If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks is an innovator of high-performance analog/digital, &RF semiconductors, Acoustic Filters and integrating ultra-dense System-in-Package solutions that will be powering the next wireless transformation. Together, we will build the next generation of wireless platforms focused on enabling the Automotive Industry, Cellular Infrastructure, Smart Houses/Smart Cities through IoT, and the AI/ML revolution. Through our broad technology/packaging expertise and one of the most extensive product portfolios in the industry, we are Connecting Everyone and Everything, All the Time. At Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management, and the freedom to make meaningful contributions in a setting that encourages creative thinking. We value open communication, mutual trust, and respect. We are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together are changing the way the world communicates. Summary The Diversified Analog Solution (DAS) Business Unit covers a wide range of established and emerging market segments, including WiFi, automotive, IoT, and infrastructure. As a leader in the System Architecture team of DAS BU, you will lead the overall strategy, planning and execution of the packaging technology development through an innovative mindset and working with your cross functional peers, within and outside of the business unit to take projects from initial definition, through design implementation cycles, and launch the projects to mass production. Responsibilities Serve as the subject matter expert for package design and process development for new technologies and establish baselines for assembly and packaging including: SMT Flip chip Die attach, molding, underfill, dispense, EMI shielding, lid, and solder ball attach 3D stack die technology Heterogeneous integration Collaborate, contribute to and drive implementation of advanced packaging and assembly technologies across the BU's product portfolio Develop and own packaging assembly processes including material characterization and down-selection for wafer-level and chip-level systems Serve as DAS BU interface with TMG for all new technology introduction (NTI) for assembly packaging lines Identify and define package cost breakdown and package cost reduction opportunities Provide packaging expertise to design engineering leads and teams to refine the packaging design in process development. Provide frequent technical seminars to the engineering community to drive and enhance understanding of upcoming state-of-the-art packaging technologies Provide technical expertise in customer meetings and represent the voice of customer internally to deliver to expectations Qualifications Master's degree in Mechanical Engineering, Material Science, Applied Physisc or related discipline 15+ years of consumer electronics or semiconductor industry experience Hands-on packaging, PCBA, and SMT assembly experience Experience with technology and product planning and development cycles Strong communication skills Track record of in developing new RF package designs and deploying them into High-Volume manufacturing environments Experience in working with OSAT companies in Asia In-depth experience in assembly and module design, from highly integrated SiP to high-power amplifiers Experience in CAD layout and simulation tools The typical base pay range for this role across the U.S. is currently USD$166,600 -$333,100 per year. Starting base pay will depend on relevant experience and skills, training and education, business needs, market demands, the ultimate job duties and requirements, and work location. Skyworks has different base pay ranges for different work locations in the U.S. Benefits include access to healthcare benefits (including a premium-free medical plan option), a 401(k) plan and company match, an employee stock purchase plan, paid time off (including vacation, sick/wellness, parental leave), among others. Employees are eligible to participate in an incentive plan, and certain roles are also eligible for additional awards, including recognition and stock. These incentives and awards are based on individual and/or company performance. Skyworks is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, or any other characteristic protected by law.Skyworks strives to create an accessible workplace; if you need an accommodation due to a disability, please contact us at accommodations@skyworksinc.com.